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FRSM Series of Precision Chip Resistors
Vishay Foil Resistors
FIGURE 4 - RECOMMENDED MOUNTING
Notes
(1) IR and vapor phase reflow are recommended.
(2) Avoid the use of cleaning agents which could attack epoxy resins, which form part
of the resistor construction
(3) Vacuum pick up is recommended for handling
(4) If the use of a soldering iron becomes necessary, precautionary measures should
be taken to avoid any possible damage / overheating of the resistor
* Recommendation: The solder fillet profile should be such as to avoid running over
the top metallization
*
PULSE TEST
TEST DESCRIPTION
All parts baked at +125°C for 1 hr and allowed to cool at room
temperature for 1 hr, prior to testing. By using an electrolytic 0.01μF
capacitor charged to 1000 VDC, a single pulse was performed on 20
units of 1206, for each value: 100 ? , 1K ? and 10K ? of Surface
Mount Vishay Foil resistor and Thin Film resistor. The unit was
allowed time to cool down, after which the resistance measurement
was taken and displayed in ppm deviation from the initial reading.
TEST RESULTS
FIGURE 6 - THERMAL SHOCK TEST
Test per MIL PRF 55342 4.8.3 Mil STD 202, Method 107
Test Conditions: 100 X (-65°C to +150°C), n=10
100
80
60
40
20
FIGURE 5 - PULSE TEST DESCRIPTION
0
-20
0805
1K
0805
8K
1206
1K
1206
25K
2512
1K
2512
75K
ELECTROSTATIC DISCHARGE (ESD)
ESD can be categorized into three types of damages
"#
*+
!)
Parametric Failure - occurs when the ESD event alters one or more
device parameters (resistance in the case of resistors), causing it to
shift from its required tolerance. This failure does not directly pertain
to functionality; thus a parametric failure may be present while the
device is still functional.
Catastrophic Damage - occurs when the ESD event causes the
device to immediately stop functioning. This may occur after one or
TABLE 5 - PULSE TEST RESULTS
a number of ESD events with diverse causes, such as human body
discharge or the mere presence of an electrostatic field.
THIN
FILM
VALUE
100R
VOLTAGE
T= RC
1μsec
AVERAGE DEVIATION
(%)
VISHAY
FOIL
RESISTOR
Open
Latent Damage - occurs when the ESD event causes moderate
damage to the device, which is not noticeable, as the device appears
to be functioning correctly. However, the load life of the device has
been dramatically reduced, and further degradation caused by
operating stresses may cause the device to fail during service.
Latent damage is the source for greatest concern, since it is very
1K
10K
1000VDC
10 μsec
100 μsec
<0.001
>35
>0.008
difficult to detect by re-measurement or by visual inspection, since
damage may have occurred under the external coating.
www.vishayfoilresistors.com
4
For any questions, contact: foil@vishaypg.com
Document Number: 63209
Revision: 8-Nov-12
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